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February 27, 2013

Mtg: Packaging: The Core of Competitive Advantage

by @ 11:25 am. Filed under ALL, Communications, Electronics Design, Engineering Mgmt, Semiconductors

THURSDAY March 28, 2013
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Bill Chen, Fellow of ASE Group, & Past President of the CPMT Society
Time: Registration at 11:30 AM; Buffet lunch at 11:45 AM; Presentation at 12:15 PM
Cost: $15; $5 for fulltime students and currently unemployed; $5 more at door
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: from website

Since the invention of transistors in 1947, and the invention of integrated circuits in 1958, the semiconductor and electronics industries have been at the core of global productivity and economic growth. From mainframe computers to PC, and from PC to smart phones and tablets, there have been many disruptive changes in electronics market drivers, as well as major shifts in technology direction, business creation, and business consolidation. Electronic packaging is a global business, encompassing dynamic technologies and multi-faceted professional communities. As a global business, it comprises the front end of the electronic product industry and the backend of the semiconductor industry. Its technologies span design, manufacturing and assembly process, test, materials, and equipment.
Today’s consumers have the dominant market share of electronics products. Mobility is a way of life. Packaging at the backend has become a dynamic force for innovation and invention responding the market requirements for diverse functionality, form factor, cost, and time to market. Packaging is, indeed, playing an integral role and through the development of sophisticated technologies and processes, is becoming the important enabler to competitive advantage within an increasingly dynamic electronics market.
We shall take some examples from Cu wirebond, flip chip and wafer level packaging to illustrate the dynamic evolution of our technologies. The drive for heterogeneous integration has led to the flowering of packaging innovations including TSV (2.5D & 3D), embedded technologies, and new materials and equipment in our ecosystem. Looking to the future, electronic products are being designed on a highly customized basis for individuals, groups, and populations, whose taste, lifestyle, and spending power vary significantly, one to another. And, clearly, our packaging profession and packaging technologies are a mainstay at the core of competitive advantage

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