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April 13, 2013

Mtg: A Comparison of Low-Cost Interposer Technologies

by @ 8:15 am. Filed under ALL, Electronics Design, Semiconductors
 

THURSDAY May 23, 2013
SCV Components, Packaging and Manufacturing Technology  Chapter
Speaker: Terry Kang, Sr. Packaging Development Manager, Nvidia
Time: Networking and lunch at 11:30 AM; Presentation at 12:15 PM
Cost: $15 for lunch ($5 for students, unemployed); no cost for presentation
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv/meetings/cpmt1305l.html

The 2.5D through-silicon-via interposer is the key enabling technology for integrating multi-functional dies to achieve higher electrical performance and smaller package form factors.  One of the key challenges for high-volume production is high cost.  This presentation introduces and compares the pros and cons of low-cost interposer technologies including thin silicon, organic and glass interposers for “Logic (AP or GPU) + Memory” 3D integration.

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