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March 21, 2008

Mtg: Flip-Chip Substrates For Advanced Applications

by @ 5:34 pm. Filed under ALL, Communications, Computers/Software, Electronics Design, Engineering Mgmt, Semiconductors

SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Bernd Appelt, Director, Worldwide Business Development, ASE (U.S.) Inc.
Time: Lunch at 11:45 AM, Presentation at Noon
Cost: $15 if reserved by March 24; $20 at door
Place: Ramada, 1217 Wildwood Ave (Fwy 101 frontage road, between Lawrence Expressway and Great America Parkway), Sunnyvale
RSVP: by email with Ed Aoki,


The continuing advancements in silicon technology are driving further innovation in flip-chip substrate technology. ? Market dynamics have lead to a de facto standardization of build-up technology for flip chip substrates for CPUs, graphics and gaming processors and ASICs. ? More advanced substrates like coreless and high density core substrates have been developed but their market penetration has yet to happen. ? The most aggressive substrate development is now driven by mobile applications seeking to embed components directly into the substrate. ? Discretes as well as active die can be embedded successfully but market penetration is pending the development of new business models because the supply chain will be changed by these new substrates. ? Likewise the development of flip-chip chip-scale substrates is also driven by mobile applications to become a low cost and high volume technology.

In this presentation, the different substrate technologies will be reviewed. ? The market dynamics of the substrate evolution will be described and opened up for discussion.


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