IEEE S.F. Bay Area Council e-GRID's
BayAreaTech

Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences

October 1, 2013

Mtg: MEMS and BioMEMS in Laminates

by @ 1:39 pm. Filed under ALL, BioEngineering, Electronics Design, Semiconductors
 

THURSDAY October 24, 2013
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Professor Mark Bachman, Dept. Electrical Engineering and Computer Science, University of California-Irvine
Time: Buffet lunch at 11:30 AM; Presentation at 12:15 PM
Cost: $15; $5 for fulltime students and currently unemployed; $5 more at door
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv

Post-semiconductor manufacturing processes (PSM), including packaging and printed circuit board (PCB) manufacturing, are now capable of producing trace widths of a few micrometers, high-aspect-ratio vias, three-dimensional constructions, and highly integrated systems in a single small package. Such PSM technology can in principle be used to manufacture micro electromechanical systems (MEMS) for sensing and actuation applications. Although MEMS are traditionally produced using silicon processes, the broad array of manufacturing approaches available in the packaging industry — including lamination, lithography, etching, electroforming, machining, bonding, etc. — and the large number of available materials such as polymers, ceramics, metals, etc., provides greater design freedom for producing functional microdevices. The results of such processes applied to fabricating small systems are heterogeneously integrated MEMS devices.
In many cases laminated MEMS devices are more suited to their applications than their silicon counterparts, especially for applications such as biomedical, optical, and human sensing. Furthermore, such microdevices can be built with a high degree of integration, pre-packaged, and at low cost. Indeed, the PCB and packaging industries stand to benefit greatly by expanding their offerings beyond serving the semiconductor industry and developing their own devices and products. This talk illustrates that good-quality MEMS devices can be manufactured using packaging-style fabrication, particularly using stacks of laminates, and discusses some of the unique benefits of such devices. This “laminate MEMS” technology promises not only improved methods for manufacturing microdevices but also for heterogeneously integrating them with silicon microelectronics and other components into a single package.

131024scv

Comments are closed.

[IEEE S.F. Bay Area Council - www.e-grid.net] [powered by WordPress .]

SF Bay Area Council

Categories

  • ALL (4,557)
  • Antennas & Propagation (4)
  • BioEngineering (663)
  • Blogroll (33)
  • Circuits (11)
  • Communications (1,853)
  • Computers/Software (1,744)
  • Consumer Electronics (97)
  • Control Systems (18)
  • Electrical/Power (1,263)
  • Electronics Design (2,768)
  • Employment (4)
  • Employment opportunities (5)
  • Engineering Mgmt (1,805)
  • Green energy (40)
  • History (3)
  • Industrial Applications (73)
  • Information Theory (10)
  • Magnetics (22)
  • Microwave (8)
  • NanoEngineering (869)
  • Optics/Displays (968)
  • Photonics (24)
  • PhotoVoltaics (3)
  • Product Safety (21)
  • Reliability (34)
  • Robotics and Automation (15)
  • Semiconductors (1,827)
  • Signal Processing (132)
  • Vehicular Technology (9)
  • Women in Engineering (7)
  • Young Professionals (2)
  •  

    Support our advertisers:

    Visit our
    GRID MARKETPLACE

    Enabling Javascript allows us to show you upcoming conferences in this column.

    For the Firefox browser, select Tools/Options/Content and select "Enable Javascript".

    If you are using Microsoft Internet Explorer you may need to click on the yellow bar above and select 'Allow Blocked Content'. You must then click 'Yes' on the following security warning.

    archives:

    October 2017
    S M T W T F S
    « Sep    
    1234567
    891011121314
    15161718192021
    22232425262728
    293031  

    View in Google Calendar

    search blog:


    SUBSCRIBE: Get the e-GRID twice a month by email - upcoming IEEE SF Bay Area meetings, conferences.

    RSS Feed Subscribe to our RSS Feed.

    PUBLICIZE your event to IEEE's membership.


    general links:

    22 queries. 0.567 seconds