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October 23, 2013

Mtg: Thermoreflectance Technique for Thermal Characterization and Thermal Mapping

by @ 9:22 am. Filed under ALL, Electronics Design, Optics/Displays, Semiconductors
 

THURSDAY November 7, 2013
SCV Reliability Chapter
Speakers: Dr. Mo Shakouri, Dustin Kendig, Mark Aghili, Microsanj LLC
Time: Sign-in/Networking at 6:30 PM; Presentation at 7:00 PM
Cost: none
Place: Agilent Technologies, 5301 Stevens Creek Blvd, Santa Clara
RSVP: not required
Web: ewh.ieee.org/r6/scv/rl

Transient thermal analysis is becoming a critical tool in research, development and quality analysis of state of art devices and circuits.  This educational workshop will cover an overview of thermal imaging techniques, the latest on thermoreflectance solutions and capabilities plus a live hands-on demo.
An overview of thermal imaging techniques is given . Miniaturization of electronic and optoelectronic devices and circuits have increased switching speeds exasperating localized heating problems.  Steady-state and transient characterization of temperature distribution in devices and interconnects is important for performance and reliability analysis.  In this talk, we review various microscale and nanoscale thermal characterization techniques that could be applied to active and passive devices.  Various contact and contactless techniques such as infrared microscopy, liquid crystal, micro Raman, Scanning thermal microscopy, and thermoreflectance will be reviewed.
High-speed transient thermoreflectance imaging of power transistor arrays, SCRs, BJTs, HEMPTs, microcoolers, GaN, LEDs and solar cells will be reviewed.  These images show temperature non-uniformities, point defects, and open circuits in test samples. Sub-micrometer spatial resolution and 800 picosecond temporal resolution allow the characterization of skin effects and current crowding in high-speed electronic devices.
Finally, a live demonstration of thermoreflectance imaging will be conducted.

131107scv

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