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October 24, 2013

Mtg: 3D Heterogeneous Microsystem Integration for Biomedical Applications

by @ 11:37 am. Filed under ALL, BioEngineering, Communications, Electronics Design, Semiconductors
 

TUESDAY November 5, 2013
SCV PACE (Professional Activities Committee for Engineers)
Speaker: Prof. Amine Miled, Electrical Engineering and Computer Science Department, Univ of Laval, Quebec
Time: Networking with food and drinks at 6:00 PM; Presentation at 6:30 PM
Cost: $5
Place: Texas Instruments Auditorium, 2900 Semiconductor Dr, Santa Clara
RSVP: from website
Web: www.eventbrite.com/event/8846960497

Lab-on-Chip (LoC) are in their way to become the new biomedical standard.  This talk covers new developments and extended use of LoC, to integrate new technologies, in addition to new modeling techniques approaches.  The objective is to design a LoC with new functions for a fully autonomous device.
In this seminar, a first prototype of an LoC with microelectronics and microfluidic modules, integrated communication system and embedded power supply unit in order to separate micro and nanoparticles with in vitro validations in cerebrospinal fluid are presented.  A micro particle separation was achieved through the monitoring of electrical field propagation, frequency, phase and amplitude using different architectures of electrodes.  Our objective is to propose new diagnostic tools for a better understanding of neurodegenerative diseases.
We also came up with an innovative approach to give greater flexibility to the modeling of LoCs.  This approach consists of modeling the behavior of particles based on the architectural design of the electrodes, the applied signals, and the biological properties of the medium.  This modeling technique is based on a hybrid approach including a finite element modeling using ANSYS, and an algorithm implemented on Matlab.  Then it was possible to calculate each particle’s 3D position in a micro channel based on the results provided by ANSYS, which is not possible based on experimental results.
Also, we built this system entirely with a 3D architecture using heterogeneous technologies including a microfluidic chip, a Bluetooth wireless unit, and an embedded power supply module.  The whole microelectronic part of the LoC is designed with CMOS 0.18 um TSMC technology.  The microfluidic architecture was fabricated with a new microfabrication process using femto laser and high accuracy dicing saw.

20131105scv

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