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November 30, 2013

SCV-EMC: High-Speed Serial Link Design

by @ 2:11 pm. Filed under ALL, Communications, Electronics Design, Semiconductors
 

TUESDAY December 10, 2013
SCV Electromagnetic Compatibility
Subject: High-Speed Serial Link Design
Speaker: Joseph C. (Jay) Diepenbrock, Lorom America
Time: Networking and light dinner (small fee) at 5:30 PM; Presentation at 6:30 PM
Cost: none, for talk
Place: Agilent Technologies, Bldg. 5L, 5301 Stevens Creek Blvd, Santa Clara
RSVP: not required
Web: www.ewh.ieee.org/r6/scv/emc

This presentation discusses some of the key electrical properties that affect the performance of high speed serial channels and what affects them.  It covers insertion and return loss, loss mechanisms, and the influences of various packaging elements including printed circuit board materials, connectors, cables, and vias.  The benefits of equalization in lossy channels will be discussed.  Test equipment and techniques for characterizing serial channels will be covered as well as software tools for simulating channel performance.

20131210scv

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