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April 20, 2008

Mtg: Thermal Stress Modeling in Electronic and Photonic Engineering: Is FEA the Only Tool?

by @ 3:56 pm. Filed under ALL, Electronics Design, Engineering Mgmt, Optics/Displays

SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Dr. Ephraim Suhir, CPMT Society Distinguished Lecturer; Bell Laboratories (ret); Dept of Electrical Engineering, UC-Santa Cruz; Dept of Mechanical Engineering, Univ of Maryland
Time: Seated dinner at 6:30 PM, Presentation (no cost) at 7:30 PM
Cost: $25 for dinner
Place: Ramada Inn, 1217 Wildwood Ave (Fwy 101 frontage road, near Lawrence Expy), Sunnyvale
RSVP: by email to Janis Karklins,

? This talk addresses the role and attributes of, as well as the state-of-the art and major findings in, the field of analytical thermal stress modeling in electronic and photonic engineering. The emphasis is on simple and practical models that can be and have been used in the physical design and reliability evaluations of electronic and photonic assemblies, structures and packages.

It covers the role, attributes, merits and shortcomings of analytical thermal stress modeling, and its interaction with numerical (primarily finite-element) and experimental techniques. The topics addressed include Timoshenko’s bi-metal thermostat theory and its extension; thermally matched assemblies and assemblies bonded at the ends; design recommendations; thin film structures; polymeric materials and plastic packages of IC devices; photonic (primarily fiber optic) structures; and application of probabilistic approaches. Thermal stress modeling in nano-materials and nano-structures is also briefly discussed.

A review paper “Analytical Thermal Stress Modeling in Electronic and Photonic Systems” is available upon request. It will be published later on this year in the ASME Applied Mechanics Reviews.

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