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December 3, 2013

Mtg: High-Performance Datacenter Platform: Using InP for Silicon Photonics

by @ 8:39 pm. Filed under ALL, Computers/Software, Electrical/Power, Electronics Design, Optics/Displays, Semiconductors

WEDNESDAY January 8, 2014
SCV Components, Packaging and Manufacturing Technology Chapter, with Photonics
Speaker: Dr. Michael Lebby, President and CEO, OneChip Photonics; Professor of Optoelectronics, Glyndwr University, Wales, UK
Time: Optional dinner at 6:00 PM; Presentation at 6:45 PM
Cost: $20; $10 for full-time students and unemployed ($5 more at door)
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website

Is a high-performance datacenter platform using InP a silicon photonics play?  This issue will be addressed. Designing and packaging InP-based PICs (Photonic Integrated Circuits) & OEICs (Optoelectronic Integrated Circuits) will be discussed.  A review of packaging technologies for datacom products will be made. Particular attention will be a focus on a highly reliable and robust platform with Photonic Integrated Circuits (PICs) that have included lasers, modulators, detectors, waveguides, Mux/Demux, and large spot converters by OneChip Photonics.  Current products are focused on both client-side and line-side applications in data and tele-communications networks.  Initial performance levels indicate suitability for 100Gb/s datacenter and 50Gb/s metro opportunities using OneChip’s InP-based OEIC platform.


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