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August 25, 2007

3D Architectures for Semiconductor Integration and Packaging

by @ 8:45 am. Filed under ALL, Communications, Computers/Software, Electronics Design, Engineering Mgmt, Semiconductors
 

Sponsored by Research Triangle Institute — TechVentures 2007
— Oct 22-24, 2007 ? ? ? — Hyatt Regency S.F. Airport, Burlingame
— “Going Mainstream: Defining the Technology and Market Opportunities”

? ? ? Earlybird Rates through October 1st
Full details: techventure.rti.org/fall2007

Various forms of 3D integration and packaging are now reaching commercialization as serious contenders for meeting performance, cost, and size demands. Learn the status
of competing technology solutions, commercialization plans, and the key enablers to near- and long-term applications.
SESSIONS: ? – Industry Leadersâ?? Perspectives ? – The Market Perspective on 3-D ? – A Hard Look at Why and Where for 3-D ? – Tools for Manufacturing: Options and Capabilities ? – Design Tools and Considerations ? – Commercial 3-D: Leading the Way Forward ? – Research Advancements ? – 3-D Packaging Approaches ? …
Plus two panels: ? – 3-D Memory with TSVs: Ready for Prime Time? ? – What Will Be the Tipping Point?

?

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