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February 5, 2014

Mtg: Power Semiconductor Packaging and System-on-a-Substrate Power Technology

by @ 11:37 am. Filed under ALL, Electrical/Power, Electronics Design, Semiconductors

WEDNESDAY March 12, 2014
SCV Components, Packaging and Manufacturing Technology, and Power Electronics Chapters
– energy efficiency, switch frequency, integration, innovative solutions …
Speaker: Nathan Zommer, PhD, CEO and CTO, IXYS Corporation
Time: Networking and buffet dinner at 6:00 PM; Presentation (no cost) at 6:45 PM
Cost: $20; $10 for full-time students and unemployed ($5 more at door)
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website

Over the last three decades we have witnessed the market acceptance of Si-based Power MOSFETs and IGBTs in power systems.  Growth in demand was driven by the need to improve the energy efficiency of these systems, by the need to generate energy from renewable resources and by the development of better medical devices.  The performance envelopes for these new devices required new methods of assembly, new packages and integration that will add value and allow the full benefits of the new ‘power chips’ to be used by design engineers.  The requirements included higher switching frequency operation, high thermal conductivity, high temperature and high voltage stability, electrical isolation and system integration at the device level.  In this talk we summarize innovative assembly and packaging solutions that meet these requirements with cost reduction, size and weight reduction and suitability for automated production lines.  The key feature of the described technology is the use of DCB and DAB as the core substrate instead of the classical all-copper lead frame or baseplate.


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