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February 16, 2014

Mtg: Extreme Ultraviolet Photolithography

by @ 12:05 pm. Filed under ALL, NanoEngineering, Optics/Displays, Semiconductors
 

TUESDAY March 4, 2014
SCV Photonics Chapter
– density, feature size, power, transition plans …
Speaker: Mark Phillips, EUV lithography group, Intel
Time: Networking and Pizza at 6:00 PM, Presentation at 7:00 PM
Cost: none
Place: Intel Auditorium, Building SC-12, 3600 Juliette Lane, Santa Clara
RSVP: from website
Web: ewh.ieee.org/r6/scv/leos

Traditional optical lithography is reaching the limits of its resolution, and continuing improvements in integrated circuit density are becoming progressively harder.  For the past decade, the semiconductor industry has been working on moving to extreme ultraviolet/soft x-ray wavelengths for exposing photomasks, which should allow significant future reductions in feature size.  The author will discuss the technical challenges faced by the industry in making this transition, and the current state of the art, along with predictions for how the transition will take place.  Getting sufficient power from the EUV sources has been perhaps the main limiting challenge, and he will address some of the problems in this area as well.

20140304scv

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