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March 6, 2014

Mtg: Directions in Device Packaging for Mobile Applications

by @ 1:11 pm. Filed under ALL, Communications, Electronics Design, Semiconductors
 

THURSDAY March 27, 2014
SCV Components, Packaging and Manufacturing Technology Chapter
– IC packages, low profile, pin counts, die sizes, trends …
Speaker: E. Jan Vardaman, President, TechSearch International, Inc.
Time: Registration and buffet lunch at 11:30 AM; Presentation (no cost) at 12:15 PM
Cost: $15; $5 for full-time students and unemployed ($5 more at door)
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv/meetings/cpmt1403l.html

Mobile Devices are driving the unit volume growth in semiconductor packaging today. Growth in wafer-level packages (WLPs) continues to be driven by the strong preference for small form factor, low profile packages. A variety of pin counts and die sizes are also found in watches, MP3 players, digital cameras, laptops and tablets. Emerging areas such as wearable electronics will require low-cost and small form factor packages. Fan-out WLPs (FO-WLPs) are receiving increased interest for more than just single-die packages and are emerging as a new potential format for System-in-Package (SiP). This presentation examines application trends for packages, trends in pin count, die size, and ball pitch, and discusses the challenges for today’s package designer.

20140327scv

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