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March 23, 2014

Mtg: The Evolution of Laser Singulation

by @ 3:32 pm. Filed under ALL, Optics/Displays, Semiconductors
 

THURSDAY April 24, 2014
SCV Components, Packaging and Manufacturing Technology Chapter
– for ICs, MEMS, LEDs, yield, grooving, recent advances …
Speaker: Devin Martin, Manager of Technology Development, Disco Hi-Tec America
Time: Registration and buffet lunch at 11:30 AM; Presentation (no cost) at 12:15 PM
Cost: $15; $5 for full-time students and unemployed ($5 more at door)
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv/meetings/cpmt1404l.html

The drive to improve yield and quality while reducing the manufacturing cost of ICs, MEMS, and LEDs has led to the development of several new laser-based singulation methods.  Stealth Dicing has proven to be advantageous for many LED and MEMS devices, while laser grooving has become a necessity for ICs at 45nm and below.  This presentation will cover several recent advances in laser dicing and grooving.

20140424scv

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