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March 24, 2014

Mtg: 3D Gesture Recognition: A 512×424 CMOS 3D Time-of-Flight Image Sensor with Photo-Demodulation; Ultrasonic 3D Rangefinder on a Chip

by @ 4:12 pm. Filed under ALL, Electronics Design, Optics/Displays, Semiconductors
 

MONDAY April 21, 2014
SCV Circuits and Systems Chapter, with Solid State Circuits
– signal path, frames, range error; MEMS, ASIC …
Speakers: Dr. Cyrus Bamji, Microsoft Corp.; Dr. Richard Przybyla, Chirp Microsystems
Time: Networking/Light Dinner at 6:30 PM; Presentations at 7:00 PM
Cost: $2 donation accepted for food
Place: QualComm, Building B, 3165 Kifer Road, Santa Clara
RSVP: from website
Web: sites.ieee.org/scv-cas

In the first talk, the pixel and signal path of a 512�424-pixel ToF image sensor is presented.  Consecutive frames with different modulation frequencies are combined, which enables a range error of less than 1% over ranges from 0.8 to 4.2m.  Modulation frequencies up to 130MHz are supported, and the modulation contrast at 50MHz is 67%.
In the second talk, an ultrasonic 3D rangefinder system uses an array of AlN MEMS transducers and custom readout electronics to localize targets over a +/-45 degree field of view up to 1m away.  The 0.18?m CMOS readout ASIC comprises 10 independent channels with separate high voltage transmitters, readout amplifiers, and ADCs. Power dissipation is 400?W at 30fps, and scales to 10?W/ch at 10fps.

20140421scv

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