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June 27, 2014

Mtg: PCB Design and Fabrication Process Variations for Embedding Passive and Active Components

by @ 6:58 pm. Filed under ALL, Electronics Design, Engineering Mgmt, Semiconductors
 

WEDNESDAY October 8, 2014
SCV Components, Packaging and Manufacturing Technology Chapter
– discretes, passive and active, assembly …
Speaker: Vern Solberg, Technical Consultant
Time: Networking and buffet dinner at 6:00 PM; Presentation (no cost) at 6:45 PM
Cost: $25 for IEEE Members, $30 for non-members, $10 for studens/unemployed
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv

Embedding components within the PC board structure is not a new concept, however, until recently, most applications adapted only passive elements. The processes relied on resistive inks and films for the resistor elements and enhanced dielectric layering for capacitors.  And although these methods remain viable, many companies have evolved into placing discrete passive and active components within the PC board layering structure.  Many have found that by reducing the component population on the PC board’s surface, board level assembly is less complex and the PC board can be made smaller, The smaller substrate, even when more complex, often results in lower cost. Although size and cost reductions are significant attributes, the close coupling of key elements can also contribute to improving functional performance.
The presentation will focus on the six basic embedded component structure designs described in IPC-7092.  The process variations define the structure, depending on whether components are passive or active, placed and/or formed and if they are on one side of the PCB base-core or both. Both formed and placed components may be located on any number of layers, however, formed components are generally assigned to dedicated layers.  The layering description actually becomes part of the type designation that is very similar in describing an eight layer (2-4-2) HDI board and the naming indicates whether the base-core represents a final assembly or is simply a mounting base onto which additional layers are sequentially added.

20141008scv

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