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October 14, 2014

Mtg: Innovative Pressure-Sensing Solutions

by @ 2:07 pm. Filed under ALL, NanoEngineering, Optics/Displays, Semiconductors
 

WEDNESDAY November 19, 2014
SCV MEMS and Sensors Chapter
– ultra-small devices, DRIE Etch, cavities, non-uniformities …
Speaker: Holger Doering, Chief Operating Officer, Silicon Microstructures, Inc.
Time: Pizza and beverages at 7:15 PM; Presentation at 7:45 PM
Cost: $5 donation for food
Place: Qualcomm Cafe @ Building B, 3165 Kifer Road, Santa Clara
RSVP: from website
Web: sites.ieee.org/scv-mems

MEMS Pressure Sensor portfolio and the different Technologies/Process methods that are used to manufacture them; Specialties of SMI pressure sensors to address niche medical markets as well as high-volume automotive markets; Application examples for SMI pressure sensors in the different markets; Design, Simulation and Process requirements for development and manufacturing of advanced pressure sensors
DRIE Etch for MEMS pressure sensor miniaturization: Comparison of classic wet etch processes to DRIE to create ultra-small devices; Advantages of DRIE in process control to achieve high accuracy and repeatability; Limitation of DRIE etched devices and how they can be addressed by intelligent design; Products at SMI that benefit from the advantages of DRIE Etching; Different approaches of using DRIE formed cavities for pressure sensor devices; Compensation of process related non-uniformities by design adjustments
Automated Optical Inspection (AOI) for defect detection in MEMS Devices: Automated optical Inspection to assure highest quality of MEMS Devices; Importance of visual inspection in MEMS devices to assure reliability; Criteria and methods that are used to detect the different types of defects; Inspection of frontside and backside as well as in different stages of the process to access visually all critical areas; Benefit of having pictures from inspections available as quality gate before shipment; Reduction of Inspection time and cost by automated detection and classification ofdefects by AOI

20141119scv

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