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October 27, 2014

Mtg: Thermal Management & Reliability of Power Electronics in Renewable Energy & Transportation Applications

by @ 1:30 pm. Filed under ALL, Electronics Design, Semiconductors
 

THURSDAY November 13, 2014
SCV Components, Packaging and Manufacturing Technology Chapter, with Consultants’ Network of Silicon Valley
– packaging, bonding wire, hybrid vehicles, inverters, cooling …
Speaker: Dr. Eckhard Wolfgang, European Center of Power Electronics, and University of Dortmund
Time: Networking and buffet lunch at 11:30 AM; Presentation (no charge) at 12:15 PM
Cost: $25 for IEEE Members, $30 for non-members, $10 for students, unemployed ($5 more at door)
Place: Biltmore Hotel, 2151 Laurelwood Rd, Santa Clara
RSVP: from website
Web: www.cpmt.org/scv

In this presentation we will discuss the broad range of demands and technologies for power electronics applications, as distinct from the needs of microelectronics. I will demonstrate the importance of building in system reliability from the very early stage of design, and share examples of hybrid vehicles and inverters where this approach has been used effectively. Examples of Integrated Power Boards, Thermal Interface Materials, and bonding wire will be presented. Finally I will discuss some cooling technologies, including liquid cooling, used in thermal management of power electronics.

20141113scv

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