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April 30, 2015

The Current Capabilities and Future Challenges of Acoustic Microscopy (AM) for 3D Interconnect & Underfill Inspection

by @ 4:59 pm. Filed under ALL, Semiconductors
 

Thursday, May 21, 2015 
SVC Components, Packaging, and Manufacturing Society (CPMT) 
Subject: The Current Capabilities and Future Challenges of Acoustic Microscopy (AM) for 3D Interconnect & Underfill Inspection
– C-SAM® systems, can be applied to 3D IC interconnect, especially in wafer bond quality, thickness, bow, warp, sori and flatness… 
Speaker: Steven R. Martell, Manager for Advanced Applications Support at Sonoscan, Sonoscan, Inc. 
Time: 11:30 am: Networking/Light lunch, Presentation: noon to 1 pm 
Cost: Free for IEEE members; $5 non-members 
Place: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Web: http://www.cpmt.org/scv/ 
RSVP by May 19th: http://www.cpmt.org/scv/meetings/cpmt1505l.html 

20150521ALL

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