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July 29, 2008

Mtg: Electro-Optical Microscopy: Evolution in Component and Package-Level Inspection

by @ 6:14 pm. Filed under ALL, BioEngineering, Electronics Design, NanoEngineering, Optics/Displays, Semiconductors
 

THURSDAY November 20, 2008
SCV Components, Packaging and Manufacturing Technology Chapter
Speaker: Andrew Kominek, Micro Analysis Group, Keyence Corporation
Time: Registration at 11:30 AM, Buffet lunch at 11:45 AM, Presentation at 12:15 PM
Cost: $15 if reserved by Nov. 17; $20 after & at door
Place: Ramada Inn, 1217 Wildwood Ave (Fwy 101 frontage road at Lawrence Expressway), Sunnyvale
RSVP: by email to Ed Aoki, aoki.ed@gmail.com
Web: www.cpmt.org/scv

This presentation introduces digital microscope technology and its application in semiconductor development, failure analysis, and quality control. ? The integration of rapidly advancing digital image processing with slowly improving optical microscopy has advanced the use of microscopy as a tool for the component, process and packaging engineer. ? Bridging of the two technologies has allowed for unprecedented inspection and image analysis capabilities. ? Advanced optics and software algorithms produce high resolution images with near-infinite depth-of-field; SEM-like images are the result.? Post-processing of captured images allows the user to change point of view and to make critical measurements, as well as inserting comments and arrows.

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