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May 27, 2015

Adhesion and Thermo-mechanical Reliability for Emerging Device, Energy and Bio-Technologies

by @ 1:45 pm. Filed under ALL, BioEngineering, Electronics Design, Semiconductors
 

Thursday, June 4th, 2015 
SCV Reliability Chapter 
Subject: Adhesion and Thermo-mechanical Reliability for Emerging Device, Energy and Bio-Technologies 
-Debonding and cohesive fracture are major challenges, characterizing thin-film thermomechanical properties, emerging device technologies, integrating new multi-functional hybrid films, underlying molecular structure … 
Speaker: Prof. Reinhold H. Dauskardt, Materials Science and Engineering, Stanford University 
Time: 6:00pm: Check-in, food & drinks; 6:30 to 7:30 pm: Presentation 
Cost: Free 
Location: Qualcomm Inc, 3165 Kifer Rd, Santa Clara, in the cafeteria in B building 
Event Registration: http://www.eventbrite.com/e/adhesion-and-thermomechanical-reliability-tickets-17148140550 
Food sponsored by ICE Labs, ISO 9001 & 17025 Reliability Test Lab, www.rel-test.com

20150604ALL

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