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July 30, 2015

3D Printed Package Components for High Performance Packaging

by Editor @ 2:14 pm. Filed under ALL, Consumer Electronics, Semiconductors
 

Tuesday, August 25, 2015 
SCV Consumer Electronics (CE) 
Subject: 3D Printed Package Components for High Performance Packaging 
– print complex structures with multi-material inks, mechanics of the technology and manufacturing platform, package types such as SiP, PoP … 
Speaker: Philip Rogren, VP of Product Development, EoPlex 
Time: 6:30 pm: pizza & drinks, 7:00 – 8:30 pm: Presentation 
Cost: IEEE members – $5, Non-IEEE members – $10, IEEE CES and IEEE Student members – Free 
Location: NVIDIA – 2800 Scott Blvd., Building E, Santa Clara 
Event Details: https://www.eventbrite.com/e/ieee-consumer-electronics-society-aug-25-2015-3d-printed-package-components-for-high-performance-tickets-17963994792

20150825ALL

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