Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences
Tuesday, August 25, 2015Â
SCV Consumer Electronics (CE)Â
Subject:Â 3D Printed Package Components for High Performance PackagingÂ
– print complex structures with multi-material inks, mechanics of the technology and manufacturing platform, package types such as SiP, PoP …Â
Speaker: Philip Rogren, VP of Product Development, EoPlexÂ
Time: 6:30 pm: pizza & drinks, 7:00 – 8:30 pm: PresentationÂ
Cost: IEEE members – $5, Non-IEEE members – $10, IEEE CES and IEEE Student members – FreeÂ
Location: NVIDIA – 2800 Scott Blvd., Building E, Santa ClaraÂ
Event Details:Â https://www.eventbrite.com/e/ieee-consumer-electronics-society-aug-25-2015-3d-printed-package-components-for-high-performance-tickets-17963994792
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