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July 31, 2015

23rd International Symposium on High Performance Interconnects

by @ 7:27 pm. Filed under ALL, Electrical/Power, Electronics Design, Semiconductors
 

 23rd International Symposium on High Performance Interconnects

The IEEE HOT INTERCONNECTS 23 Conference on August 26-28 features state- of-the-art hardware and software architectures and implementations for interconnection networks of all scales, ranging from multi-core on-chip networks to those within systems, clusters, data centers, and clouds. See the complete Advance Program for conference, tutorials and keynotes. The conference and tutorials are discounted for Registration before August 14.
* Host Keynote: Commercial Computing Trends and Their Impact on Interconnect Technology – Rick Hetherington, Oracle
* Keynote 2: Recent Advances in Machine Learning and Their Application to Networking – David Meyer, Brocade
* Invited Paper: Intel Omni-Path Architecture: Enabling Scalable-, High-Performance Fabrics – Todd Rimmer, Intel; * Panel: HPC vs. Data Center Networks; Regular Sessions: * Network and Interface Architectures, * Optics and NOCs, * Efficient Network Design; Tutorials: * Accelerating Big Data Processing with Hadoop, Spark, and Memcached Over High-Performance Interconnects, * ONOS Tutorial Hot Interconnect, * Flow and Congestion Control for High Performance Clouds: How to Design and Tune the Datacenter Fabric & SDN for Big Data, * Software-defined Wide-Area Networking: Challenges, Opportunities and Reality

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