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September 21, 2015

Chips ‘Face-Up’ Panelization Approach for Fan-Out Packaging

by @ 9:33 pm. Filed under ALL, Semiconductors
 

Wednesday, October 14, 2015 
SCV Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: Chips ‘Face-Up’ Panelization Approach for Fan-Out Packaging 
– die with preformed Cu studs are placed face-up on a carrier, high density RDL wiring, Adaptive Patterning strategies …
Speaker: Boyd Rogers, Deca Technologies, Inc.
Time: 11:30 am: lunch; 12 noon to 1:00 pm: presentation 
Cost: $5 for IEEE members, students, and unemployed; no cost for talk-only at noon. Please register in advance so we know how much food to purchase, but pay at the door. 
Location: Texas Instruments (TI), Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details and registration: http://www.cpmt.org/scv/meetings/cpmt1510.html

20151014ALL

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