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October 30, 2015

Embedded micro devices: A new way to build low cost, 3D, integrated MEMS devices

by @ 12:39 pm. Filed under ALL, Semiconductors
 

Wednesday, November 11, 2015 
SCV Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: Embedded micro devices: A new way to build low cost, 3D, integrated MEMS devices 
– IoT, post-semiconductor manufacturing processes PSM), including packaging and printed circuit board (PCB) technologies, can be used to manufacture MEMS for sensing and actuation applications…
Speaker: Prof. Mark Bachman, Department of Electrical Engineering and Computer Science University of California Irvine, and Chief Technical Officer, Integra Devices, LLC, Irvine 
Time: 11:30 pm: check-in, light food, networking; 12:00 noon to 1:00 pm: presentation; please arrive by 11:45 am 
Cost: $5 for IEEE members, students, and unemployed; $10 for non-IEEE members; no cost for talk-only at noon. Please register in advance so we know how much food to purchase, but pay at the door. 
Location: Texas Instruments (TI), Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details and registration: http://1511lcpmt.eventbrite.com

20151111ALL

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