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September 9, 2008

Mtg: Solid State Drive (SSD) Reliability

by @ 8:07 am. Filed under ALL, Communications, Computers/Software, Electronics Design, Semiconductors
 

WEDNESDAY September 24, 2008
SCV Reliability Chapter
Speaker: Dr. John McNulty, DfR Solutions
Time: Refreshments at 6:30 PM, Presentation at 7:00 PM
Cost: none
Place: HP Oak Room, Bldg 48 (Pruneridge Ave. and Wolfe Rd), Cupertino
RSVP: not required
Web: www.ewh.ieee.org/r6/scv/rl

This presentation will address three critical areas of solid state drive (SSD) reliability: (i) single- and multi-event upsets; (ii) the influence of decreasing dimensions on the critical failure mechanisms of integrated circuits; and (iii) high density packaging and solder joint stability. Event upsets will be addressed through review of existing industry data and identification of trends indicating potential risks in correcting these events. Emerging research data and models will be presented covering the dominant integrated circuit failure mechanisms (time-dependent dielectric breakdown, hot carrier injection, negative bias temperature inversion, electro-migration, and soft errors due to alpha particle-induced damage), illustrating the sensitivity of each mechanism to feature dimensions and evidence that the current industry approach to predicting failure rate and time to failure may be inadequate. Lastly, analysis of failure mechanisms for advanced packaging solutions (stacked die, silicon vias, emerging solder joint geometries & materials, and others) will be discussed, based on an understanding of interconnect degradation behavior and how the mechanical and material properties of high density packaging is limiting useful lifetime.

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