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January 12, 2016

Enabling Requirements for High Volume Thermocompression Bonding

by @ 12:51 pm. Filed under ALL, Semiconductors
 

Thursday, February 25, 2016 
SCV Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: Enabling Requirements for High Volume Thermocompression Bonding 
– key factors have enabled this transition, including advanced TCB equipment with higher UPH for cost reduction and advanced methods of inline process control… 
Speaker: Tom Strothmann, Director Advanced Packaging Next-Generation Products, Kulicke & Soffa Industries, Inc. 
Time: 11:30 am: Networking, sandwiches & drinks; 12:00 noon to 1 pm: Presentation 
Cost: $5 for IEEE members, students, and unemployed; $10 for non-IEEE members 
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details and Registration: http://1602l2cpmt.eventbrite.com

20160225ALL

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