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January 28, 2016

Recent Advances and Trends in Semiconductor Packaging

by @ 12:12 pm. Filed under ALL, Semiconductors
 

Tuesday, April 12, 2016 
SCV Components, Packaging, and Manufacturing Technologies (CPMT) 
Subject: Recent Advances and Trends in Semiconductor Packaging 
– fan-out wafer/panel-level, 3D IC packaging, 2.5D IC Integration, embedded 3D hybrid integration, 3D CIS/IC integration, 3D MEMS/IC integration … 
Speaker: John H. Lau, Sr. Technical Advisor ASM 
Time: 11:30 am: Networking, sandwiches & drinks; 12:00 noon to 1 pm: Presentation 
Cost: $5 for IEEE members, students, and unemployed; $10 for non-IEEE members 
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details and Registration: http://1604lcpmt.eventbrite.com

20160412ALL

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