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March 14, 2016

Package Requirements for High-Speed Systems

by @ 2:26 pm. Filed under ALL, Semiconductors, Signal Processing
 

Tuesday, May 10, 2016
SCV Components, Packaging, and Manufacturing Technologies (CPMT) and Circuits and Assembly (CAS)
Subject: Package Requirements for High-Speed Systems
– key electrical characteristics: signal loss, signal crosstalk, return loss, mode conversion, power integrity and other important factors affecting the bandwidth of high-speed systems…
Speaker: Wendem T. Beyene, Technical Director, Rambus Inc.
Time: 11:30 am: Networking, sandwiches & drinks; 12:00 noon to 1 pm: Presentation
Cost: $5 for IEEE members, students, and unemployed; $10 for non-IEEE members
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
Event Details and Registration: http://www.cpmt.org/scv/

20160510ALL

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