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August 18, 2016

A Statistical FEA Method for Predicting Glass Fracture in Consumer Electronic Products

by @ 10:19 pm. Filed under ALL, Consumer Electronics, Electronics Design, Reliability
 

Thursday, August 25, 2016
SCV Signal Processing Society (SPS)
Subject: A Statistical FEA Method for Predicting Glass Fracture in Consumer Electronic Products
– probability of fracture for glass components during drop impact, size and rate effects on glass strength, the temporal and spatial nature of the stress results, and the combining of drop orientations to produce a probability of failure …
Speaker: Marc Zampino, Senior Design Analysis Engineer, Amazon/Lab126
Time: 6:00 pm: Registration, networking, and refreshments; 6:30 pm to 7:30 pm: Presentation; 7:30 to 8:00 pm: Question and answer session
Cost: Free, Donations accepted for food
Location: Qualcomm Inc., in the Cafeteria, 3165 Kifer Rd, Santa Clara
Event Details: http://ewh.ieee.org/r6/scv/rl/
RSVP to know how much food to purchase: https://www.eventbrite.com/e/a-statistical-fea-method-for-predicting-glass-fracture-in-consumer-electronic-products-tickets-27186020118
Food sponsored by I.C.E. Labs, ISO 9001 & 17025 Reliability Test Lab, http://www.icenginc.com

20160901ALL

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