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October 7, 2016

IEEE International 3D System Integration (3DIC) Conference 2016

by @ 3:13 pm. Filed under ALL, Computers/Software, Consumer Electronics, Electronics Design, Semiconductors
 
EEE International 3D System Integration (3DIC) Conference 2016

3DICon Nov. 9-11, 2016, San Francisco

The third International Conference on 3D System Integration (3D-IC) will be held in San Francisco in November, 2016. 3D-IC covers all the topics in 3DIC, including 3D process technology, materials, equipment, circuits technology, design methodology and applications. The conference invites authors and participants to submit and interact with 3D research from all around the world. This is the third conference in the series. The first two were held in Japan, the fourth will be held in Europe.

Highlights of the Conference Include the Following:
* Hear the latest in 3D process technology, design, applications and CAD during the main technical sessions.
* Special sessions will focus on (1) dielet processing and applications, and (2) Advances in Through Silicon Vias 
* On Friday afternoon, attend a tutorial on 3DIC technology design and CAD.
* Hear keynotes on Exascale computing and other topics.
Advanced registration can be found at 3dic-conf.org. Advanced registration closes October 15. The hotel room block closes October 10.

 

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