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January 22, 2017

Bonding Technology for Hybrid Integration 

by @ 11:18 pm. Filed under ALL, Semiconductors
 

Wednesday, January 25th 2017 
SCV MEMS and Sensors 
Subject: Bonding Technology for Hybrid Integration 
– multiple ways to integrate CMOS controllers, sensors and actuators, future product development of multi-functional integration with the DBI 3D hybrid integration … 
Speaker: Dr. Guilian Gao, Invensas 
Time: 6:30 pm to 8:00 pm 
Cost: Free 
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara 
Event Details: https://goo.gl/28C5Nj 

20170125ALL

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