How to Peel Ultra-Thin Dies from Wafer Tape
Thursday, December 7, 2017
SCV Electronic Packaging Society (EPS – formerly CPMT)
Subject: How to Peel Ultra-Thin Dies from Wafer Tape
– bending stress, die strength, peel force, die structures, wafer processing steps, TSVs, pickup methods, experimental verification …
Speaker: Dr. Stefan Behler, Senior Expert Process Engineer, Besi Switzerland AG
Time: 11:30 am: Registration, refreshments, and networking; 12:00 pm noon: Presentation and Q&A
Cost: IEEE Members: $5; Non-Members: $10
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
Event Details: http://www.cpmt.org/scv/?p=451
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