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October 11, 2017

IEEE SCV-EMC 2017 Mini Symposium – Technical Exchange

by @ 2:27 pm. Filed under ALL, Signal Processing
 
ELECTROMAGNETIC COMPATIBILITY / INTERFERENCE

Interconnects are moving beyond 56GBps per single physical channel. Are you prepared to control EMI/EMC issues for tomorrow’s data rate? 
Attend the IEEE SCV-EMC 2017 Mini Symposium – Technical Exchange, and you will learn:

Common PCB Layout Errors that Cause Products to Fail to Meet EMC Requirements
Learn to recognize potential problem areas and maintain control of unwanted coupling paths

Signal Integrity Designs for 56Gb/s and Beyond 
* Challenges and design difficulties for higher data rate 
* PCB material characterization and measurement techniques for high-speed channel 
* Via modeling methodologies and applications in PCB and package 
* PAM4 channel analysis 
* Evaluations of possible solutions for new challenges

This mini-symposium will be held on October 12 at the Biltmore Hotel in Santa Clara. For more information, see scvemc.org/2017Mini-Symposium.html 
Full time students can come FREE starting from the afternoon session but must register with caroline.chan.us@ieee.org (first, last, email, school).

 

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