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January 29, 2018

International Conference and Exhibition on DEVICE PACKAGING

by @ 6:50 pm. Filed under ALL, Semiconductors
 
01011100    COMPUTING AND SEMICONDUCTORS    10100101

The International Conference and Exhibition on DEVICE PACKAGING

is the largest 2018 conference dedicated to interposers, 3D IC & packaging, fan-out WLP, flip chip, MEMS & sensors, and 3D printing. The Device Packaging Conference and Exhibition will be the one FOWLP/3D conference you will not want to miss. It features:iMAPS* 60 presentations on FOWLP, 3D, Microsystems
* Poster Session featuring 20+ presentations & Happy Hour!
* 5 Keynotes on 3DIC, Heterogeneous Integ., SiP, Automotive
* 13 short courses on: 3D, Fanout, High Density Pkg, Cu Pillars, & more
* A sold-out exhibition of 66 booths…the companies you need to see

The iMAPS Device Packaging Conference is from March 5-7, outside of Phoenix, and set among Arizona’s captivating Sonoran Desert, with spectacular views of Arizona’s majestic Four Peaks and iconic Red Mountains alongside the free-flowing Verde River. Go to imaps.org/devicepackaging for more information. Early bird registration and hotel deadline is February 7th.


 

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