Technology & Networking in Silicon Valley & the SF Bay Area: Upcoming Meetings, Courses and Conferences
Thursday, May 3, 2018
SFBA Electronics Packaging Society (EPS)
Subject: 2D to 3D Package Architectures: Back to the Future
– scaling, heterogeneous integration, impact on power, performance, latency, nomenclature for package architectures, current metrics, projections …
Speaker:
Time: 11:30 am: Registration, sandwiches, and networking; 12:00 noon to 1:00 pm: Presentation
Presentation-only: 12:00 noon (come at 11:45) – Free
Cost: IEEE Members, students, unemployed: $5; Non-Members: $10
Location: Texas Instruments Building E Conference Center, 2900 Semiconductor Dr., Santa Clara
Event Details: cpmt.org/scv
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