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March 8, 2009

Seminar/Webinar: Green Reliability – What Comes Next?

by @ 1:51 pm. Filed under ALL, Communications, Computers/Software, Electrical/Power, Electronics Design, Engineering Mgmt, NanoEngineering, Optics/Displays, Semiconductors
 

FRIDAY May 8, 2009
SCV Reliability Chapter
Speakers: Dr. Cheemin BoLinn, Peritus Partners; Dr. Alan Wood, Sun Microsystems; Prof. Subhasish Mitra, Stanford University; Bryan Stallard, Ops A La Carte (see below)
Time: Registration at 8:30 AM; Seminar from 9:00 AM – Noon
Cost: none
Place: De Anza College, Conference Rooms A&B in the College Center, Cupertino; also simultaneously on the web
RSVP: see website
Web: www.ewh.ieee.org/r6/scv/rl

Today, the topic of Green is discussed more and more. Every day we hear about companies “going green”. But what does this really mean? In fact, “Going Green” has many implications, from the materials being used to the type of energy being used and the quantity being consumed. And each aspect of “Going Green” has reliability implications. Any time we change material properties or design concepts, there are inherent reliability risks that need to be addressed.

Getting the Bang – Green Agile Solutions Designed for Eco-Environmental Impact!,
Dr. Cheemin BoLinn, Peritus Partners
As significant investments in green technology continue, there are immense opportunities to demonstrate leadership in designing reliable green technologies and products. These green solutions can fulfill the need for increased power with a smaller or net zero carbon footprint.? This session will examine:
1) Trends and directions in the clean tech industry for green, reliable solutions
2) Hotbed investment areas
3) Ecosystem view of energy efficiency
4) Business and environmental impact of green reliability and efficiencies
5) Value proposition for green “carbon neutral” technical designs
6) “Greening” as an economic growth driver and implications for marketing

The End of Redundancy – Alternative Methods for Achieving High Reliability, Alan Wood, Sun MIcrosystems
Minimizing power consumption has become a very important topic in the design of components, computers, and data centers. Industry analysts predict that, within the next few years, the cost of power will surpass the cost of compute equipment in the data center. Dependability research has not traditionally considered the cost or availability of power to implement the proposed techniques. If redundant equipment was needed for fault-tolerance, it was blithely assumed that the power and other facilities overhead was negligible. That assumption is no longer valid, and dependability research and practice needs to change accordingly.
The dependability community is faced with the challenge of using less power while maintaining the same levels of dependability. Existing assumptions need to be altered, and new research is needed.

Globally Optimized Robust System Design, Prof. Subhasish Mitra, Stanford University
Most future systems — not just high-end mainframes and safety-critical systems — must be designed such that they can cope with imperfections in the underlying hardware. In contrast, today’s design methodologies assume perfect hardware during useful system lifetime. Classical redundancy techniques are too expensive and inadequate for this purpose.
This talk will present an overview of techniques that can enable a sea change in robust system design:
1. Built-In Soft Error Resilience (BISER) for correcting radiation-induced soft errors;
2. Circuit Failure Prediction, together with on-line self-test, to overcome early-life failures and transistor aging;
3. Effective test and post-silicon validation techniques.

EDA Usage in Reliability Aspects of Green Technology, Bryan Stallard, Ops A La Carte
The use of Electronic Design Automation (EDA) in GREEN situations, specifically in lowering energy consumption, is a natural extension of long-existing usage in two related contexts: thermal management in complex systems, and portable-device battery-limited usage. For years semiconductor companies, and their EDA suppliers, have battled power dissipation issues, driven by the twin facts that MOS ICs burn power proportional to clock frequencies, and that as majority-carrier devices, the MOSFET elements have channel resistances that increase with the absolute temperature, to limit both raw speed and race-condition margins.
At board levels, the issue bifurcates between commercial usages, where convective cooling is dominant, and military/aerospace use where conductive cooling is primary. In portable devices, the ability to use a product without continuous recharging is a goal.
Three topics are worth considering, or revisiting, in a GREEN light:
1) Conversion of existing circuitry to emphasize or improve energy-consumption performance;
2) Modification of production designs to meet RoHS or other material issues;
3) Development of ongoing engineering practices to institute or upgrade Green features to a level parallel with expectations.

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