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April 18, 2009

Mtg: Hotspot Management and Micro-Refrigeration in Integrated Circuits

by @ 9:36 am. Filed under ALL, Electronics Design, Semiconductors
 

MONDAY April 20, 2009
SCV Circuits and Systems Chapter, with Components, Packaging and Manufacturing Technology Chapter
Speaker: Prof. Ali Shakouri, School of Engineering, UC-Santa Cruz
Time: Fast food and drinks at 6:30 PM, Presentation at 7:00 PM
Cost: none
Place: Cadence Design Systems, Building 5, 655 Seely Avenue, San Jose
RSVP: not required
Web: ewh.ieee.org/r6/scv/cas

Static and dynamic hot spots are one of the key factors limiting the performance and reliability of electronic devices and integrated circuits.? Various simulation and characterization tools to predict and measure hot spots will be reviewed.? We show that transient thermoreflectance imaging using CCD camera can be used to measure temperature distribution in chips with 0.1C temperature, 100 nanosecond time and submicron spatial resolution. Examples from multi-finger and high-power transistor structures are presented.? We also introduce a power blurring technique which can be used to obtain the transient temperature profile in packaged IC chips with calculation times orders of magnitude faster than finite element analysis.? Finally, we review solid-state microrefrigerators on a chip.? SiGe alloy and superlattice thin films have demonstrated localized cooling by 7C at 100C ambient temperature.? Novel nanocomposites are developed where the heat and charge transport are modified at the atomic level. Potential to remove hot spots with power densities exceeding 1-2kW/cm2 will be discussed.

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