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April 18, 2009

Mtg: Is Cu Wirebonding for Real?

by @ 9:43 am. Filed under ALL, Electronics Design, Semiconductors
 

THURSDAY April 23, 2009
SCV Components, Packaging & Manufacturing Technology Chapter
Speaker: Jack Belani, Vice President of Marketing & Sales, Heraeus Inc.
Time: Registration at 11:30 AM; Buffet lunch at 11:45 AM; Presentation at 12:15 PM
Cost: $15 if reserved by Feb. 24; $20 at door, no cost for presentation-only
Place: Biltmore Hotel, 2151 Laurelwood Rd (Fwy 101 at Montague Expressway), Santa Clara
RSVP: via the Council’s DoubleKnot registration page
Web: www.cpmt.org/scv

The semiconductor packaging industry has attempted to use Cu wire in place of Au wire for several decades.? These attempts in the past have been made each time the industry was under severe cost pressures during cyclical downturns.? However in the past (pre 2004) attempts the industry was unable to get adequate traction towards getting any critical mass for this transition.
However, since the year 2004, as the price of Au has escalated, there has been a tremendous effort to reduce costs, and Cu wire bonding has become a number 1 priority towards the cost reduction efforts.? This presentation reviews the status of Cu wire and discusses its potential and issues.

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