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  • Feb 3, 2005     Location: Intel (Airport Road)
    Short tutorial on “Fundamentals of Packaging” : P R Patel of Intel
    Highlighted of issues normally encountered in high performance processors
    A good overview on packaging concepts

  • March 18     Location: Delphi ITPL
    -Tutorial: Mechanical Aspects of Electronic Packaging: Venkata Krishna (Delphi)
    -Emerging Standards in Thermal Simulation: Sarang Shidore (Flomerics)


  • March 29     Location: IISC
    Merging MEMS and Wafer Level Packaging
    C. S. Premachandran, IME Singapore; Later presented at BEL, Bangalore
    Focus to wafer level packaging for MEMS and also touched upon Bio MEMS

  • May 6     Location: Texas Instruments CV Raman Nagar
    Lecture: Failure Analysis of Packages: Prof. Radhakrishnan of NanoRel
    Highlighted the need for FA during development and techniques used

  • June 24     Location: GE Whitefield facility
    - Topic yet to be announced

    K Raghunathan
    Founding Chair
  
     
Bangalore is in a unique situation; explosive growth in silicon solution providers along with steady increase in Systems Solution / PCB players; even test capability is coming on board...
 

-Electronics Packaging refers to the science and art of providing a suitable environment to the electronic product as a whole to perform reliably over a period of time...More >>

-The EDAPs Workshop is to enhance the technical awareness in the Asia region specifically in area of package and system electrical design concepts, issues and challenges ahead for next generation electronic products....More >>