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(A) Electrical
Design of Advanced Packaging and Systems
(EDAPS) |
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Date: Dec 12 & 13, 2005
Location: Windsor manor Sheraton, Bangalore
The
EDAPS work shop is to enhance the technical
awarness in the Asia specifically in area
of package and system electrical design
concepts, issues and challenges ahead for
next generation electronic products.
Registrations completed as per the registration form in WORD document which can be downloaded from the site is to be sent to ieee.cpmt.blr@gmail.com . The registration fee is payable by Cheque/DD to the address provided in the registration document. Overseas registrants: please send e-mail for details on payment instructions
Download Registration Form [Word doc] [Pdf] |
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Upcoming in 2005
7th Electronics Packaging Technology Conference (EPTC 2005)
7-9 December, 2005
Singapore
Contact: Ms Shirley SOH, Nanyang Technological University, +(65) 6790-4826, enquiry@eptc-ieee.net
7th International Conference on Electronics Materials and Packaging (EMAP 2005)
December 11-14, 2005,
Tokyo Institute of Technology, Japan
Contact: Prof. Satoru AIHARA, Tokyo Institute of Technology info@emap2005.sms.titech.ac.jp
Upcoming in 2006
IEEE Systems Packaging Japan Workshop
Jan 30 - Feb 1, 2006
Hakone, Japan
Preliminary Advance Program
Abstracts Due: Nov. 30, 2005 (no paper required)
Contact: Hiroshi Go, Hitachi Corp, hiroshi.go.wt@hitachi.com
More Conference Information |
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| Bangalore is in a unique situation; explosive growth in silicon solution providers along with steady increase in Systems Solution / PCB players; even test capability is coming on board... |
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-Electronics Packaging refers to the science and art of providing a suitable environment to the electronic product as a whole to perform reliably over a period of time...More >>
-The EDAPs Workshop is to enhance the technical awareness in the Asia region specifically in area of package and system electrical design concepts, issues and challenges ahead for next generation electronic products....More >> |
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