Components, Packaging & Manufacturing Technology Society

Malaysia Chapter

IEEE

Events by CPMT Malaysia

ALL EVENTS ORGANIZED BY CPMT MALAYSIA

The following activities have been tentatively planned for the year 2015 and upcoming 2016. These activities have been carefully considered and the speakers/invited guests are well selected to bring the utmost benefit and knowledge advancement to IEEE-CPMT Malaysian Chapter members.

2016 KEY EVENTS

37th INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) - 18th ELECTRONICS MATERIALS & PACKAGING (EMAP) CONFERENCE 2016

by Components Packaging and Manufacturing Technology (CPMT) Society of IEEE & Korean-American Scientists and Engineers Association

Date: 20th - 22nd SEPTEMBER, 2016

Venue: G HOTEL, GEORGE TOWN, PENANG, MALAYSIA

UPCOMING TECHNICAL EVENTS

SEMICONDUCTOR ADVANCED PACKAGING WORKSHOP: LATEST TRENDS IN ADVANCED PACKAGING: DRIVING PACKAGE VOLUMES WITH MOBILE AND WEARABLE PRODUCTS

by E. Jan Vardaman (President TechSearch International, Inc. Austin, Texas)

Date & Venue: G HOTEL, PENANG, 7th SEPTEMBER, 2015

Date & Venue: SHANGRI-LA HOTEL, PUTRAJAYA, 8th SEPTEMBER, 2015

SEMICONDUCTOR ADVANCED PACKAGING WORKSHOP: INTERNET OF EVERYTHING – LATEST TREND, CHALLENGES, APPLICATIONS AND CASE STUDIES

by Hamid Syed (Director, Supply Chain Cisco (HK) Ltd Hong Kong)

Date & Venue: G HOTEL, PENANG, 7th SEPTEMBER, 2015

Date & Venue: SHANGRI-LA HOTEL, PUTRAJAYA, 8th SEPTEMBER, 2015

Technical Seminar "Finite Element Modelling in Electronic Packaging"

by Prof. Dr Mohd Nasir Tamin (Universiti Teknologi Malaysia)

Date: TBD, 2015

Technical Seminar "Metallic Nanoparticle Loaded Lead-Free Solder: Interfacial Structure & Properties"

by Prof. Dr Haseeb (Universiti Malaya)

Date: TBD, 2015

EDUCATION EVENTS

Education Talk "“I Have Never Registered Even Though I Have Worked as an Engineer for Years – Is It Really Necessary?”

by Adj. Prof Cheang Kok Meng (former Executive Director, Institution of Engineers Malaysia

Date: 18th March 2015

IEEE Best FYP Projects Award 2015

Recognition for Best IEEE Final Year Project

Date: March until December, 2015

PROFESSIONAL COURSES

1 day course on "Advanced Packaging for Microelectronic Packaging"

One course each in Klang Valley & Penang

Date: September 2015

UPCOMING CPMT CONFERENCES IN 2016

37th INTERNATIONAL ELECTRONICS MANUFACTURING TECHNOLOGY (IEMT) - 18th ELECTRONICS MATERIALS & PACKAGING (EMAP) CONFERENCE 2016

PENANG, MALAYSIA

Date: September 20 - September 22 2016

CPMT CONFERENCES IN 2015

2015 65th IEEE Electronic Components & Technology Conference (ECTC 2015)

San Diego, CA USA

Date: May 26 - May 29 2015

6th Asia Symposium on Quality Electronic Design (ASQED 2015): Internet of Things (IoT)

Penang, Malaysia

Date: August 3 - August 5 2015

2015 16th International Conference on Electronic Packaging Technology (ICEPT)

Changsha, China

Date: August 11 - August 14 2015

2015 20th European Microelectronics Packaging Conference (EMPC)

Friedrichshafen, Germany

Date: September 14 - September 16 2015

2015 Workshop on Accelerated Stress Testing & Reliability (ASTR)

Boston, MA USA

Date: September 9 - September 11 2015

2015 IEEE 23rd Conference on Electrical Performance of Electronic Packaging and Systems (EPEPS)

Portland, OR USA

Date: October 26 - October 29 2015

2015 IEEE 24th Electrical Performance of Electronic Packaging & Systems (EPEPS)

San Jose, CA USA

Date: October 25 - October 28 2015