HIGHLIGHTS
1.
IEMT2010
Presented
Papers.
1.1
Total
of 91 papers and 7 poster papers were presented with ~40%
International papers in 98 oral presentation sessions.
1.2
Total
of 17 countries participated, covering SEA, Asia, Europe and
USA.
1.3 More than 200 total
participants.
2.
IEMT2010
Short
Courses/Keynotes
2.1
Dr. John Lau - Short Course on “State-Of-The-Art
and Trends in 3D IC/Si Integrations and WLP”
2.2
Dr. Ho Hong Meng - Short
Course on “Advanced
Copper Wirebonding”
2.3
Mr. Joe Fjelstad - Short
Course on “Past, Present and
Future of Packaging”
2.4
Dr. Yutaka Tsukada - Short Course on “Flip Chip Technology”
2.5
Dr. Rolf Aschenbrenner (CPMT President) – Keynote talk on “Heterogeneous Integration - A Key Enabling
Technology”
2.6
Mr. CC Lee (Cisco) -
Keynote talk on “Innovation
and Collaboration - Keeping up with Market Demands And
Transitions”
2.7
Dr. Yutaka Tsukada
(I-PACKS) – Keynote
talk on “Current
Technology Barriers and Future Direction for Packaging
Density Increase”
2.8
Dr.
William Chen (ASE) -
Keynote talk on “The Practice of Engineering in The Year of
The Tiger”
2.9
Dr.
Knoblauch Andreas (Infineon) - Keynote talk on “Automotive Electronics – Packaging As Enabler
Technology”
2.11 Mr. Joe Fjelstad (Verdant
Electronics) - Keynote talk
on “Importance of
Reliability In Electronics”
2.12
Mr. YC Ng (National
Semiconductor) - Keynote talk on “Small Signal Electrical Testing
in Package Engineering”
2.13
Dr. Yutaka Tsukada (I-PACKS)
- Keynote talk on “Ultra Low
CTE (0 ppm/C) Polyimide Film and Its Potential Application”
2.14
Mr. John Hunt (ASE) -
Keynote talk on “Integrated
Wafer Level Packaging - An Emerging Synergism”
2.15
Mr. Shankar Shridhar (Eqis) - Keynote talk on “DFMEA/PFMEA : What They Never Teach You In Formal
School”
2.16
Mr. Amir Nur Rashid Wagiman
(Intel Corporation) - Keynote talk on “Miniaturization
Innovation Evolution of Electronics Packaging – What’s Coming
Next …?”
3.
IEMT2006
Exhibitions
3.1
Table
top exhibition
was held.
4.
Industry-University Collaboration Forum
(Sponsored by Intel)
4.1
A
special discussion forum hosted by Intel Technologies on the
collaboration between the industry and university.
A lot of good questions from the senior
managers and PA of Infineon, TI, On Semi, Carsem, National, ST
etc. with
very inspirational discussion were held.
5.
IEMT2010
Dinner
and
Tour
5.1
Local
cultural performance was presented while the participants were
having Conference Banquet Dinner with international buffet
dinner at the hotel Grand Ballroom.
5.2
A
unique Malacca River Cruse was specially arranged after the
dinner for all the conference VVIP and participants which was
one of the highlights for IEMT2010 conference.
6.
IEMT2010
Best
Paper
Award
6.1
Best Industry Paper : “A
Reliable Low Cost Assembly Technology for 0201 Compatible QFN,
X3 Thin QFN,” WL Law et
al., Carsem Sdn. Bhd., MALAYSIA.
6.2
Best Industry Paper (Merit
Paper-1) : “Alternate Package Coplanarity Requirement
and Its Correlation to Reflow Warpage”
Lee, Yung Hsiang et al.,
Intel Technology Sdn. Bhd., MALAYSIA.
6.3
Best Industry Paper (Merit
Paper-2) : “The Very First Strain Range Bound
Guidance Methodology for System Level Shock Evaluation” Ian Chin et al., Intel
Technology Sdn. Bhd., MALAYSIA.
6.5
Best Student Paper (Master
Student Category) : “Effect On nterfacial Reactions
And Die Attach Properties Of Zn-Al-Mg-Ga High Temperature
Pb-Free Solder By Introducing Ni Metallization On Cu
Substrate”, A. Haque et al
University of Malaya, MALAYSIA.
6.6
Best Student Paper (PhD Student
Category) : “Frequency and Time Domain
Characterization of Substrate Coupling Effects in 3D
Integration Stack”, E. Eid
et al., Université de Savoie, FRANCE.
7.
IEMT2010
Final
Program
Conference
final program. (link to
file).