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Technical
Seminar |
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Reverse Engineering in the Semiconductor Industry |
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DATE/TIME
Wednesday, May 21, 2008 (4:30pm to 6:00pm) |
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PLACE
AMD Fort Collins Campus (Fort
Collins, CO)
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DIRECTIONS
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From I-25, take Harmony Road Exit (Exit 265) westbound, and enter AMD
campus on right immediately following Harmony/Ziegler intersection.
AMD is located on the NW corner of Harmony Road and Ziegler Road.
Proceed to 3rd floor for escort to seminar auditorium. Non-AMD
employees: please arrive at 4:15pm for security sign-in and escort. |
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COST
Free. As always, food &
drinks will be provided. |
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RSVP
Send e-mail to Tin Tin Wee at
tintin.wee@amd.com. |
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ABSTRACT |
The continuous drive of Moore’s law to
increase the integration level of silicon chips has presented major
challenges to the reverse engineer, obsolescing simple teardowns and
demanding the adoption of new and more sophisticated technology to
analyze chips. The following types of analysis will be covered in
detail:
- product teardown
- techniques used for system-level
analysis, both hardware and software
- circuit extraction, taking the chip down
to the transistor level and working back up through the interconnects to
create schematics
- process analysis, looking at how the
chip is made, and what it is made of
This presentation is an update of the
invited paper given at the 2007 IEEE Custom Integrated Circuits
Conference (CICC) with more focus on circuit extraction and
cross-referencing between circuit schematics and the physical layout
images obtained through scanning electron microscopy.
Chipworks further invites the membership
in the Fort Collins area to contact us for a free on-site presentation
about one of your competitor's devices. Contact
rtorrance@chipworks.com to
discuss a report that would be of interest to your team. |
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PRESENTATION SLIDES
pdf |
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REFERENCE |
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WEBSITE |
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RANDY
TORRANCE (Chipworks, Ontario, Canada)
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Randy Torrance leads
the Circuit Analysis team for the Technical Intelligence group at
Chipworks. During Randy’s 22 years in the technology industry, he has
held senior technical and management positions in the IC design and
electronic systems areas. Prior to joining Chipworks, Randy was
Director of IC Technology Development for Atmos/Mosys and was
responsible for teams designing embedded memory macros. Before
that, he spent 12 years at Mosaid, where he held positions ranging from
Senior Design Engineer through Manager IC Design to Director of IC
Design, Switching Products. Here, he led groups designing
commodity and custom memories, and large ASICs for the graphics and
networking markets. Randy holds a BASc and MASc in
Electrical Engineering from the University of Waterloo. |
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