ÿþ<HTML> <HEAD> <title>IEEE/CPMT Society - Phoenix, Arizona Chapter</title> <META name="description" content="Home Page for Phoenix, Arizona Chapter of the IEEE's Components, Packaging & Manufacturing Technology Society"> <META name="keywords" content="CPMT, IEEE, Electronics Packaging, Components, Manufacturing Technology, IC Packaging, Reliability, Electronic Materials, Transactions, Proceedings, Phoenix, Arizona"> <link href="./main.css" rel=stylesheet type="text/css" /> <meta http-equiv="Content-Type" content="text/html; charset=iso-8859-1"> <style type="text/css"> .style9 { color: #3333CC; font-weight: bold; } .style10 { height: 12.75pt; width: 79pt; color: windowtext; font-size: 10.0pt; font-weight: 400; font-style: normal; text-decoration: none; font-family: Arial; text-align: left; vertical-align: middle; white-space: normal; border: .5pt solid windowtext; padding-left: 1px; padding-right: 1px; padding-top: 1px; } .style11 { width: 332pt; color: windowtext; font-size: 10.0pt; 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bgColor=#336666 class='xs white bold'>Region 6</TD> </TR> </table> <br> <!-- main content table --> <table width=100%> <tr> <!-- left section --> <td border=1 height=120 width=160 nowrap valign=top align=left cellspacing=1 cellpadding=1> <table class='xs' width=100%> <tr align=center><td class='leftnav'><a href='index.html' class='white'>CPMT Phoenix Home</a></td></tr> <tr align=center><td class='leftnav'><a href='officers.html' class='white'>Chapter Officers</a></td></tr> <tr align=center><td class='leftnav'><a href='workshops.html' class='white'>Workshops</a></td></tr> <tr align=center><td class='leftnav'><a href='seminars.html' class='white'>Seminars</a></td></tr> <tr align=center><td class='leftnav'><a href='techtutorials.html' class='white'>Technical Tutorials</a></td></tr> <tr align=center><td class='leftnav'><a href='resources.html' class='white'>Other Resources</a></td></tr> </table> </td> <!-- middle section this is the section that varies by page --> <td width=3px>&nbsp;</td> <td valign=top align=left> <p class='s'><span class='cap'>w</span>elcome to the home page of the IEEE-CPMT Phoenix chapter. The purpose of this page is to provide information about the meetings and events we sponsor. We attempt to have (i) a monthly seminar (ii) one technical tutorial per year and (iii) a workshop in participation with the WAD chapter. </p> <p class='s'>We welcome and invite participation from speaker across the valley. Please contact us for suggestions about speakers/seminar &amp; tutorial topics. <a href="mailto:vivek.gupta@freescale.com; sunit@ieee.org; mali.mahalingam@freescale.com"> <b> Contact!</b></p> <br> <div class='m bold dblue'>Seminars</div> <br /> </a><span class="style23">2010<br /> <table border="0" cellpadding="0" cellspacing="0" style="border-collapse: collapse;width:653pt" width="869"> <colgroup> <col width="105" /> <col width="442" /> <col width="322" /> </colgroup> <tr height="17"> <td class="style10" height="17" width="105"> &nbsp;</td> <td class="style11" width="442"> Title</td> <td class="style12" width="322"> Speaker / Affiliation</td> </tr> <tr height="17"> <td class="style10" height="17" width="105"> 29-Sep</td> <td class="style24"> Flexible Printed Electronics (Macroelectronics)</td> <td class="style15" width="322"> <span style="mso-bidi-font-family:&quot;Times New Roman&quot;">Dr. Robert Reuss, Consultant</span></td> </tr> <tr height="34"> <td class="style18" height="34" width="105"> 25-Aug</td> <td class="style24"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0px"> <span style="-webkit-border-horizontal-spacing: 2px;-webkit-border-vertical-spacing: 2px"> Package Benchmarking and Key Trends</span></span></td> <td class="style15" width="322"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0px"> <span style="-webkit-border-horizontal-spacing: 2px;-webkit-border-vertical-spacing: 2px"> Mr. Joe Barrett, Director, ATTD Industry Intelligence and Analysis, Intel Corporation</span></span></td> </tr> <tr height="34"> <td class="style18" height="34" width="105"> 18-Mar</td> <td class="style14" width="442"> System Integration using Fan-out Wafer Level Package</td> <td class="style15" width="322"> Scott Hayes, Packaging Technology Manager, Freescale Semiconductor</td> </tr> <tr height="51"> <td class="style19" height="51" width="105"> 23-Jun</td> <td class="style14" width="442"> The Semblant Plasma Finish for Printed Circuit Boards</td> <td class="style15" width="322"> Mr. Greg Thomas, Senior Vice President of Worldwide Customer Service, Semblant, Inc., Chandler, Arizona 85286-1574</td> </tr> </table> </span> <br /> <br /> <a href="mailto:vivek.gupta@freescale.com; sunit@ieee.org; mali.mahalingam@freescale.com"> <span class="style23">2009</span><br /> <table border="0" cellpadding="0" cellspacing="0" style="border-collapse: collapse;width:653pt" width="869"> <colgroup> <col width="105" /> <col width="442" /> <col width="322" /> </colgroup> <tr height="17"> <td class="style10" height="17" width="105"> &nbsp;</td> <td class="style11" width="442"> Title</td> <td class="style12" width="322"> Speaker / Affiliation</td> </tr> <tr height="51"> <td class="style19" height="51" width="105"> 4-Nov</td> <td class="style14" width="442"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0px">Microelectronics Packaging Research and Education at ASU</span></td> <td class="style15" width="322"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0px">Prof. Amaneh Tasooji, Mechanical, Aerospace, Chemical, and Materials Engineering Department, Arizona State University, Tempe, Arizona</span></td> </tr> <tr height="85"> <td class="style20" height="85" width="105"> 22-Jul</td> <td class="style14" width="442"> Tailoring nanostructures towards developing portable diagnostics tools for clinical applications</td> <td class="style15" width="322"> Dr. Shalini Prasad, PhD, Adjunct Faculty, Biomedical Engineering Department, Oregon Health Science University, Portland, OR and Electrical and Computer Engineering Department at Portland State University</td> </tr> <tr height="51"> <td class="style19" height="51" width="105"> 17-Jun</td> <td class="style14" width="442"> Film-Bulk-Acoustic-Resonator for Sensing Biological / Chemical Molecules</td> <td class="style15" width="322"> Dr. Junseok Chae, PhD, Assistant Professor,<br /> Electrical Engineering, Arizona State University, Tempe, Arizona<span style="mso-spacerun:yes">&nbsp;</span></td> </tr> <tr height="68"> <td class="style13" height="68" width="105"> 20-May</td> <td class="style14" width="442"> Translational Nanoengineering for Medicine</td> <td class="style15" width="322"> Dr. Pak Kin Wong, PhD, Aerospace and Mechanical Engineering, Biomedical Engineering &amp; Bio5 Institute,<br /> University of Arizona, Tucson, AZ</td> </tr> <tr height="51"> <td class="style19" height="51" width="105"> 22-Apr</td> <td class="style14" width="442"> Intellectual Property in Today s World</td> <td class="style15" width="322"> Mr. Ed Mischen, Founder and Director, In-Source International Consulting Services, 4400 East Ridgewood Lane, Gilbert, AZ  85298</td> </tr> <tr height="51"> <td class="style19" height="51" width="105"> 18-Mar</td> <td class="style14" width="442"> Design and Development of Microwaver Connectors. How mm Waver connectors differe from RF connectors?</td> <td class="style15" width="322"> Mr. David H. Shaff, General Manager, Microwave Product Division, Southwest Microwave, Inc. (Tempe, AZ)</td> </tr> <tr height="51"> <td class="style19" height="51" width="105"> 11-Feb</td> <td class="style21" width="442"> Optimizing Return on Investment Through Effective Project Management Structure and Processes</td> <td class="style22" width="322"> Mr. Mike McCloskey, Project Management Office, RF Division , Freescale Semiconductor, Tempe, AZ 85284</td> </tr> </table> <br /> 2008<br /> <table border="0" cellpadding="0" cellspacing="0" style="border-collapse: collapse;width:653pt" width="869"> <colgroup> <col width="105" /> <col width="442" /> <col width="322" /> </colgroup> <tr height="17"> <td class="style10" height="17" width="105"> &nbsp;</td> <td class="style11" width="442"> Title</td> <td class="style12" width="322"> Speaker / Affiliation</td> </tr> <tr height="34"> <td class="style18" height="34" width="105"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">10-Dec</span></td> <td class="style14" width="442"> ITRS Assembly &amp; Packaging Roadmap</td> <td class="style15" width="322"> Mr. Debendra Mallik, Principal Engineer, Intel Corporation, Chandler, Arizona</td> </tr> <tr height="34"> <td class="style18" height="34" width="105"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">8-Oct</span></td> <td class="style14" width="442"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">Electronics in Space System Applications</span></td> <td class="style15" width="322"> Mr. Rajul Parekh, Supplier Program Manager, Orbital Sciences Corporation, Chandler, Arizona</td> </tr> <tr height="68"> <td class="style13" height="68" width="105"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">17-Sep</span></td> <td class="style14" width="442"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">Characterization of Nano Devices and Nano Characterization of Materials</span></td> <td class="style15" width="322"> Dr. Dieter K. Schroder, Professor, Department of Electrical Engineering and Center for Solid State Electronics Research, Arizona State University, Tempe, AZ 85287-5706</td> </tr> <tr height="51"> <td class="style19" height="51" width="105"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">27-Aug</span></td> <td class="style14" width="442"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">High-Bandwidth Microprocessor Packaging: Trends, Solutions, and Issues</span></td> <td class="style15" width="322"> Dr. Henning Braunisch, Process Technology Development Engineer, Component Research, Intel Corporation, Chandler, Arizona</td> </tr> <tr height="34"> <td class="style18" height="34" width="105"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">13-Aug</span></td> <td class="style14" width="442"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">Overview of FA Methodologies for Integrated Circuits</span></td> <td class="style15" width="322"> Mr. Ryan Ross, Senior Failure Analysis Engineer, Freescale Semiconductor, Inc., Tempe, Arizona</td> </tr> <tr height="51"> <td class="style19" height="51" width="105"> 25-Jun</td> <td class="style14" width="442"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 2px; -webkit-border-vertical-spacing: 2px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">MEMS Sensors and Packaging</span></td> <td class="style15" width="322"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 2px; -webkit-border-vertical-spacing: 2px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">Dr. Junseok Chae, Assistant Professor, Electrical Engineering, Ira A. Fulton School of Engineering, Arizona State University, Tempe, AZ</span></td> </tr> <tr height="34"> <td class="style18" height="34" width="105"> 14-May</td> <td class="style14" width="442"> Nano and Micro Technology-Based Next-Generation Electronics Cooling</td> <td class="style15" width="322"> Dr. Ravi S. Prasher, Intel Corporation, Chandler, Arizona</td> </tr> <tr height="34"> <td class="style18" height="34" width="105"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">27-Feb</span></td> <td class="style14" width="442"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">Confidentiality Agreements: What you Need to Know</span></td> <td class="style15" width="322"> Mr. Fredric D. Bellamy, Partner, Steptoe &amp; Johnson LLP, Phoenix, Arizona.</td> </tr> <tr height="34"> <td class="style18" height="34" width="105"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">30-Jan</span></td> <td class="style14" width="442"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">Materials Challenges for High Density Microprocessor Packaging</span></td> <td class="style15" width="322"> <span style="orphans: 2;text-align:auto;widows: 2;-webkit-border-horizontal-spacing: 0px; -webkit-border-vertical-spacing: 0px;-webkit-text-decorations-in-effect: none; -webkit-text-size-adjust: auto;-webkit-text-stroke-width: 0">Dr. Gans Ganesan, Senior Staff Packaging Engineer, Intel Corporation, Chandler, Arizona.</span></td> </tr> </table> <br /> <br /> <span class="style9">Past Seminars</span><br /> <br /> <br> <table class='xs' width='90%'> <tr class='bglgray bold'> <td width=70%>March, 2007 Technical Seminar Announcement</td><td>Wednesday, March 21st, 2007</td> </tr> <tr> <td colspan=2><span class='bold dblue'>Topic: </span>Role of Materials in Microelectronics: Past, Present and Future</td> </tr> <tr> <td colspan=2><span class='bold dblue'>Speaker: </span>Dr. Subhash Mahajan, Regents' Professor and Director, School of Materials, Arizona State University , Tempe , Arizona</td> </tr> <tr> <td colspan=2>Click <a href='./pdf/IEEE_CPMT_Phoenix_Chapter_March_21_2007_Meeting_Dr_Subhash_Mahajan.doc'>[here]</a> to download the details.</td> </tr> </table> </td> </tr> </table> </body> </html>