Dr. Hubert Harrer 
Dr. Harrer is a Senior Technical Staff Member (STSM) since 2002 working in the IBM Server and Technology Group. He received his Dipl.-Ing. degree in 1989 and his Ph.D. degree in 1992 from the Technical University of Munich. In 1993 he received a DFG research grant to work at the University of California at Berkeley in the paradigm of Cellular Neural Networks. Since 1994 he has worked for IBM in the Boeblingen Packaging Department. In 1999 he was on international assignment at IBM Poughkeepsie, New York. He was leading the z900 MCM designs and is the technical lead for z-series CEC packaging designs since 2001. This includes the system z990 and system z9 mainframe computers. His technical interests focus on packaging technology, high frequency designs and electrical analysis for first and second level packaging. He has published multiple papers and holds 7 patents in the area of packaging.