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IEEE SCV EDS Past Events and
Speaker Slides
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May
2012
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May
8, 2012
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Next Generation Photovoltaics
Speaker: Prof. Sue A.
Carter, Physics Department, University of California, Santa Cruz
IEEE
SCV Electron Devices Society
Location: Texas
Instruments Building E Conference Center
2900 Semiconductor Dr. Santa Clara, CA 95052.
Abstract/bio
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April
2012
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April.
10, 2012
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2D Carbon/Semiconductor-Enabled Electronics
Speaker: Prof. Bin Yu,
College of Nanoscale Science & Engineering,
State University of New York - Albany
IEEE
SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center
2900 Semiconductor Dr.
Santa Clara, CA 95052.
Abstract/bio
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March
2012
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Mar.
20, 2012
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FinFET/Trigate FET and Its SPICE Model
Speaker: Professor Chenming Hu, EECS, UC
Berkeley, CA, USA
IEEE
SCV Electron Devices Society
Location: Texas Instruments Building E Conference Center
2900 Semiconductor Dr.
Santa Clara, CA 95052.
Abstract/bio
Presentation
Slides
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February
2012
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Feb.
15, 2012
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2011 International Technology Roadmap for
Semiconductors (ITRS) Update - Overview and Highlights
Speaker: Alan K. Allan,
Intel Corporation, Chandler, AZ, USA
IEEE
SCV Electron Devices Society, co-sponsored by IEEE SFBA Nanotechnology
Council
Location: Texas Instruments Building E Conference Center
2900 Semiconductor Dr.
Santa Clara, CA 95052.
Abstract/bio
Presentation
Slides
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November
2011 Half-Day Symposium
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Nov.
4, 2011
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Current Status and
Future Directions of Non‐Volatile Memory Technology
Invited Speakers:
Dr. Gurtej
Sandhu, Micron
Dr. Al Fazio, Intel
Dr. Chuck Dennison, Ovonyx
Professor Michael Kozicki, Arizona State University
Dr. Joshua Yang, HP
Laboratories.
IEEE
Santa Clara Valley Electron Devices Society
Location: Texas Instruments,
Building E1, Conference Center,
2900
Semiconductor Drive, Santa Clara, CA 95051.
Announcement
Speakers’
Biographies
Talk
abstract
Agenda
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October
2011
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Oct.
13, 2011
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The Variability Issues
in Advanced CMOS: Random Dopant Fluctuation and
Random Trap Fluctuation
Speaker: Professor Steve S.
Chung, Department of Electronics Engineering, National Chiao Tung University, Taiwan.
IEEE Fellow, Distinguished Lecturer
IEEE
SCV Electron Devices Society Distinguished Lecture Program
Location: Kenna
214, Santa Clara University (direction linked below).
Abstract/bio
Presentation
Slides
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October
2011
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Oct.
11, 2011
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Carbon Electronics –
From Material Synthesis to Circuit Demonstration
Speaker: Professor H.-S.
Philip Wong, Center for Integrated Systems and Department of Electrical
Engineering, Stanford University
IEEE
SCV Electron Devices Society and IEEE SFBA Nanotechnology Council
Location: Texas Instruments
Abstract/bio
Presentation
Slides
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September
2011
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Sept.
13, 2011
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Metal interconnects for
large-area power devices – physics, challenges, and solutions
Speaker: Dr. Maxim Ershov, CTO, Silicon Frontline Technologies
IEEE
SCV Electron Devices Society
Location: National
Semiconductor
Abstract/bio
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August
2011
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August
09, 2011
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Graphene – Still Heading for Prime Time
Speaker: Prof. Zhiping Yu,
Institute of Microelectronics, Tsinghua
University, Beijing, China
IEEE
SCV Electron Devices Society
Location: National Semiconductor.
Abstract/bio
Presentation
Slides
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June
2011
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June
14, 2011
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Simulation of
Statistical Variability and Reliability: From TCAD to Statistical Circuit
Simulation
Speaker: Prof. Asen Asenov, FIEEE, FRSE;
Leader of the Device Modeling Group, University of Glasgow; CEO of Gold Standard
Simulations Ltd
IEEE
SCV Electron Devices Society and IEEE SFBA Nanotechnology Council
Location: National Semiconductor
Abstract/bio
Presentation
Slides
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May
2011
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May
10, 2011
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Characterization
and Modeling of NBTI Stress, Recovery, Material Dependence and AC
Degradation Using R-D Framework
Speaker: Professor Souvik Mahapatra, Department of Electrical Engineering, IIT
Bombay, India
IEEE
SCV Electron Devices Society
Location: National Semiconductor
Abstract/bio
Location
map and directions
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April
2011
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April
14, 2011
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Future
ESD Challenges for IC Components and Systems
Speaker: Dr. Charvaka Duvvury, Texas Instruments (Dallas, USA), EDS
Distinguished Lecturer
IEEE SCV Electron Devices Society Distinguished Lecture, cohosted
by Stanford IEEE and TCAD group
Location: Stanford University, Paul G. Allen Building Annex, Auditorium
101
Abstract/bio
Presentation
Slides
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April
2011
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April
5, 2011
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The
History of Flash Memory Technology and What Lies Ahead
Speaker: Ishai Naveh,
Adesto Technologies
IEEE SCV Electron Devices Society
Location: National Semiconductor
Abstract/bio
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March
2011
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Mar.
1, 2011
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Lithography
Options for 22nm and Beyond
Speaker: Dr. Geert Vandenberghe,
imec
IEEE SCV Electron Devices Society
Location: National Semiconductor
Abstract/bio
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Feb
2011
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Feb.
8, 2011
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Photovoltaic
Module Reliability and Failure Analysis: Enduring a storm
Dr. Glenn Alers, University of California at
Santa Cruz
IEEE SCV Electron Devices Society, co-sponsored by IEEE SCV Reliability
Society
Location: National Semiconductor
Abstract/bio
Speaker
slides
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Jan
2011
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Jan.
11, 2011
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Mechanical
Computing Redux: Relays for Integrated Circuit
Applications
Prof. Tsu-Jae King Liu, Dept. of EECS, UC
Berkeley
IEEE SCV Electron Devices Society
Location: National Semiconductor
Abstract/bio
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Dec
2010
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Dec.
2, 2010
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Millibits to Terrabits per second and
Beyond - Over 60 Years of Innovation
Dr. Renuka Jindal,
Distinguished Lecture by IEEE Electron Devices Society President
IEEE SCV Electron Devices Society
Location: Santa Clara University
Abstract/bio
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Nov
2010
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Nov
16, 2010
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Resistive
RAM: Technology and Market Opportunities
Deepak Sekar, NuPGA
Corporation
IEEE SCV Electron Devices Society
Location: National Semiconductor
Abstract/bio
Speaker
slides
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Nov 16, 2010
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Nanoelectronics: Innovation and
Implementation
Half-day symposium by the Nanotechnology Council, co sponsored by EDS
Location: National Semiconductor
For
available presentations
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Oct
2010
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Oct
12, 2010
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Is
it the End of the Road for Silicon in Power Management?
Dr. Alex Lidow, CEO Efficient Power
Conversion Corporation
IEEE SCV EDS and PELS societies
Location: National Semiconductor,
Abstract/bio
Speaker
slides
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Oct 18, 2010
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Intellectual
Property (IP) Primer for Entrepreneurs and Early-Stage Companies
Jordan M. Becker, Partner, Perkins Coie
IEEE SCV CAS and EDS societies
Location:QualComm Santa Clara, Building B
Abstract/bio
Speaker
slides
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Oct 28, 2010
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Second
Annual IEEE-SCV Soft Error Rate (SER) Workshop
Chiate Lin, Intersil;
Prof. Bharat Bhuva, Vanderbilt U.; Rick Wong,
Cisco Systems; Dr Andy Mackie, Indium Corp.; Charles Slayman,
Ops a la Carte; Dr. Brett Clark, Honeywell; Dr. Nelson Tam, Marvell
IEEE SCV CPMT/EDS/Rel societies
Location: Cisco or webinar
CPMT web page -
slides etc.
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Sept
2010
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Sept
14, 2010
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LDMOS
- Technology and Applications
Shekar Mallikarjunaswamy,
Alpha Omega Semiconductor
IEEE SCV EDS seminar
Location: National Semiconductor 2900 Semiconductor Drive , Santa Clara ,
CA 95052
Abstract/bio
Speaker
slides
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Sept 28, 2010
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The
Makers of the Microchip: Creating the Planar Integrated Circuit,
Establishing Silicon Valley
David Brock, Research Fellow, Chemical Heritage Foundation
Christophe Lecuyer, Principal Economic
Analyst, UC
Co-sponsored with IEEE SSC+CS
Location: National Semiconductor
Abstract/Bio/Registration
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Aug
2010
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Aug
10, 2010
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3-D
ICs: Motivation, Performance Analysis, Technology and Applications
Dr. Krishna Saraswat, IEEE Fellow, Dept. of
Electrical Engineering, Stanford University
IEEE SCV EDS and CPMT societies
Location: National Semiconductor, Building E-1, Conference Center
Abstract/bio
Speaker
slides
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July
2010
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July
13, 2010
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The
Foundation of Today's Digital World: The Triumph of the MOS Transistor
Ross Bassett, Lewis M. Terman, Les Vadasz, David A. Hodges
IEEE and CHM
Location: Computer History Museum.
Registration
and further info
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Jun
2010
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Jun
7, 2010
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New
Driving Force for Electromigration in ULSI Interconnections
and its implication to IC layout
Dr. Cher Ming Tan - School of EEE, Nanyang
Technological University, Singapore
IEEE SCV EDS seminar
Location: National Semiconductor
Abstract/bio
Speaker
slides
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Jun
18, 2010
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Nanoscale Manipulation of Conductive Filaments in
Solid-Electrolyte-Based-ReRAM
Prof. Ming Liu, Institute of Microelectronics, Chinese Academy of
Science (IMECAS), China.
IEEE SCV EDS seminar
Location: Santa Clara University
500 El Camino Real, Santa Clara, CA 95053
Abstract/bio
Speaker
slides
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May
2010
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May 20, 2010
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Trends
in Solar Cell Technology
Dr. Betty Prince (New Energy Strategies International)
IEEE SCV Solid-State Circuits (SSC) and Electron Devices Societies (EDS)
Location: National Semiconductor
IEEE
SSC event page
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May
11, 2010
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Thoughts
on Directions for Silicon Technology Development as We Approach the End
of CMOS Scaling
Tak H. Ning,
IBM and IEEE Fellow, and co-author of the Taur
& Ning textbook
IEEE SCV EDS seminar
Location: National Semiconductor
2900 Semiconductor Drive , Santa Clara , CA 95052
Abstract/bio
Speaker
Slides
 
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Apr
2010
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Apr
13, 2010
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The
Semiconductor Industry's Nanoelectronics
Research Initiative (NRI): Motivation and Overview
Jeff Welser, IBM/Executive Director of NRI
IEEE SCV EDS seminar
Location: National Semiconductor, Building E-1, Conference Center
Abstract/bio
Speaker
Slides
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Mar
2010
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Mar
16, 2010
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2009
International Technology Roadmap for Semiconductors (ITRS) Update -
Overview and Highlights
Alan K. Allan - SEMATECH
IEEE SCV EDS seminar
Location: National Semiconductor, Building E-1, Conference Center
Abstract/bio
Speaker
slides
Photo below with one of the first fifty 450 mm wafers ever (wafer made by
Nippon Mining & Metals).
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Feb
2010
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Feb
16, 2010
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High
Frequency Characterization of Transistors
J. Prasad, SuVolta Inc, Los Gatos, CA
IEEE SCV EDS seminar
Location: National Semiconductor, Building E-1, Conference Center
Abstract/bio
Click
here for slides
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Jan
2010
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Jan
29, 2010
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3D Interconnect - Shaping Future Technology
Full-day symposium with many exciting talks
Location: Hyatt Regency, 5101 Great America Pkwy, Santa Clara , CA 95054
Symposium: 9 AM - 5 PM
Reception/Poster session: 5 - 6:30 PM
Cost: Free. Refreshments and Lunch provided
Click
here for flyer
Click
here for Agenda
Click
here for Abstracts/bio.
List of speakers: (slides available as posted)
- Matt Nowak,
Qualcomm. Taming Cost and Design Challenges for High Density Through Silicon Stacking (TSS).
Click
here for slides
- Xiaopeng Xu, Synopsys. Modeling Thermo-Mechanical
Stress Impact on Performance and Reliability of 3D Integration
Structures.
- Sesh_Ramaswami, Applied
Materials. Journey Toward Process Convergence in TSV Technology
- Zvi Or-Bach, NuPGA. 3D FPGA - The Path to ASIC Density,
Power, and Performance.
- Deepak C. Sekar, SanDisk. A 3D-IC Technology with
Integrated Microfluidic Cooling.
- Arif Rahman, Xilinx, Inc. Technology Requirements
and Standardization for 3-D SiP.
- Tom Ritzdorf, Semitool. Advances
in Copper Fill for 3D Interconnect Applications.
- William Chen, ASE
Group. 3D and More: A Renaissance in the Making.
- Raj Pendse, STATS ChipPAC 3D Integration: The
Evolution of Device Architecture, Packaging, and Manufacturing
Infrastructure
- C. Raman Kothandaraman, IBM Through Silicon Via (TSV)
for 3D integration
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For talks
before Jan. 2010, please click here
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