In order to improve the storage bit density of a flash memory, scientist and engineers have been long working on scaling down the flash memory devices. Unfortunately, more and more challenges arise as well from either fabrication process or device physics. In this talk we will go through some of these challenges and their solutions. We will also introduce the concept of 3D flash device and explain the superiority and issues of 3D flash devices.
Biography
Dengtao Zhao is a Director of Flash Technology and Engineering in Violin Memory. Prior to this, he has worked for Western Digital and SanDisk and focused on flash memory subsystems and device optimization and reliability improvement. He received his ph.D in Condensed Matter Physics in Fudan University, China. He has over ten years experience in the area of flash memory device physics and applications.
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Last updated on 03/22/2015