Advanced packaging solutions for optoelectronic components

Lecture Announcement

	Organizer: IEEE Lasers and Electro-Optics Society and IEEE Components, Packaging and Manufacturing Technology Society
	Title: Advanced packaging solutions for optoelectronic components
	Speaker: Dariusz Sieniawsky Archray Photonics

Abstract:
Packaging of new optoelectronic devices presents a number of challenges as the devices become faster, smaller, more integrated and dissipate more thermal power. The presentation describes packaging solutions for various optoelectronic components operating at speeds of 10 and 40 Gb/s. High speed devices need careful impedance matching as well as proper design of the RF path from the external connector to the device itself. Arrayed waveguide and integrated devices require active fiber array alignment, in some cases from both ends of the device. Fiber arrays, once aligned with the waveguides, have to be securely attached to the device. Such interface has to provide low insertion loss and back reflection over a long period of time and a range of environmental conditions. Many integrated devices have a large number of electrical connections, some of which may have to be high speed. Integrated devices also tend to generate more thermal power than the discrete ones, thus requiring more advanced thermal solutions. The presentation provides an overview of packaging solutions to address those problems as well as a brief description of other advanced packaging techniques.

Biography:
Dariusz Sieniawski is a president and founder of Achray Photonics, advanced packaging development company, based in Ottawa, Canada. At Achray, Dariusz has worked on a number of cutting edge projects, including packaging platforms for 40 Gb/s and complex integrated Photonic components. Prior to Achray, Dariusz was one of the R&D managers at JDS-Uniphase and was leading a team developing Tunable Dispersion Compensator and AWGs. In the 90s Dariusz was privileged to work at the R&D labs of Nortel Networks, where he was involved and led a number of challenging, packaging related, projects. Dariusz is a member of IEEE ECTC Optoelectronic Committee since 1996.

Time and Location:
Tuesday March 11, 2003 at 10:00 a.m.
University of Toronto, Galbraigh building, Room 248
The Galbraith Building is located at 35 St. George Street.

All are welcome.
Refreshments will be served.

CONTACT:
Emanuel Istrate, e.istrate@ieee.org

The Institute of Electrical and Electronics Engineers, Toronto Section
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