Prof. John H. Lau
Hong Kong University Science & Technology

Moore's law has been the most powerful driver for the development of the microelectronic industry. This law emphasizes on lithography scaling and integration (in 2D) of all functions on a single chip, perhaps through system-on-chip (SoC). On the other hand, the integration of all these functions can be achieved through system-in- package (SiP) or, ultimately, 3D IC integration, which is a very complicated subject. It involves component and system designs, FAB, packaging, testing, and materials and equipment suppliers. The key enabling technologies for 3D IC integration and wafer-level Packaging (WLP) are, e.g., electrical, optical, thermal, and mechanical designs and tests, known good die (KGD), TSV (through silicon vias) with RDL (redistribution layers), wafer thinning and thin wafer handling, thin chip strength measurement and improving, microbump forming and assembly, low temperature C2W and W2W bonding, embedded WLP, hybrid SiP, optical PCB, and thermal management. In this lecture, all these enabling technologies will be discussed. Most of the materials are based on the technical papers published within the past 3 years by the instructor and others.

John Lau has been a visiting professor at HKUST (Hong Kong University Science & Technology) since January 2009. Prior to that, he was the Director of Microsystems, Modules & Components (MMC) Laboratory with Institute of Microelectronics (IME, Singapore) for 2 years and a Senior Scientist/MTS at HP/Agilent in California for more than 20 years. With more than 30 years of R&D and manufacturing experience, he has authored or co-authored more than 300 peer-reviewed technical publications and more than 100 book chapters, and given more than 250 presentations. He has authored and co-authored 16 textbooks on advanced packaging, solder joint reliability, and lead-free soldering and manufacturing. John earned his Ph.D. degree in theoretical and applied mechanics (University of Illinois) and three M.S. degrees in structural engineering, engineering physics and management science in North America. He is an elected ASME Fellow and has been an IEEE Fellow since 1994.